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- CPU 1510SP-1 PN
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- SIPLUS CPU 1512SP-1 PN
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SIPLUS CPU 1512SP-1 PN
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Product Number / Product Description
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List Price / Your Price
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, version in plastic black. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP66. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (5-10 mm) for signals in 3 rows, version in nickel-plated brass. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 36x M20 (7-13 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, version in plastic black. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP66. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (5-10 mm) for signals in 5 rows, version in nickel-plated brass. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, version in plastic blue. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 650x450x230, for max. 14 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 60x M20 (7-13 mm) for signals in 5 rows, version in plastic blue. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 950x450x230, for max. 24 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4.5-9 mm) for signals in 3 rows, version in plastic black. Ambient operating temperature -40...+70 °C.
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Ex enclosure made of stainless steel, IP66. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb Size (WxHxD): 950x450x230, for max. 24 iSP modules (EM/IM). Cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (5-10 mm) for signals in 3 rows, version in nickel-plated brass. Ambient operating temperature -40...+70 °C.
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